Digital IP Cores
and Subsystems

Our family of microcontroller and microprocessor related cores includes capable and competitive 32-bit BA22s and the best-available set of proven 8051s.

32-bit Processors
BA2x Family Overview

Secure Processors
Geon - Protected Execution

Application Processors
BA25 Adv. App. Processor
BA22 Basic App. Processor

Cache-Enabled Embedded
BA22 Cache-Embedded

Embedded Processors
BA22 Deeply Embedded
BA21 Low Power
BA20 PipelineZero

Processor-Based AMBA® Subsystems
Family Overview
AHB Low-Power
AHB Performance/Low-Power
AXI Custom Performance

AMBA Bus Infrastructure Cores
See Peripherals Cores >

Efficiently compress media or data with these high-performance hardware codecs. See the video and image compression Family Page for a media compression overview.

 H.264 Video Decoders
Low Latency Constrained
  Baseline Profile

Low-Power Constrained
  Baseline Profile

 H.265 HEVC Decoders
Main Profile

Companion Cores
Image Processing
WDR/HDR
CAMFE Camera Processor
Network Stacks
40G UDPIP Stack
1G/10G UDPIP Stack
• Hardware RTP Stack
  – for H.264 Encoders
  – for H.264 Decoders
  – for JPEG Encoders
IEEE 802.1Qav & 802.1Qbv
   Stack

• MPEG Transport Stream
  Mux

JPEG Still & Motion
Encoders
Baseline
Extended
Ultra-Fast
Decoders
Baseline
Extended
Ultra-fast

JPEG-LS
Lossless & Near-Lossless
Encoder
Decoder

Lossless Data Compression
GZIP Compressor
GUNZIP Decompressor
GZIP Reference Designs
    • for Intel FPGAs
    • for Xiinx FPGAs

Easily integrate memories, peripherals, and hardware networking stacks into SoCs.

Display Controllers
TFT LCD

Device Controllers
smart card reader

Flash Controllers
Parallel Flash
Parallel Flash for AHB
Universal Serial NOR/NAND
   Flash for AHB

Quickly complete the standard parts of your SoC with these memory and peripheral controllers, interfaces, and interconnect cores.

Automotive Buses
CAN

CAN 2.0/FD controller
CAN FD Reference Design
CAN Bus VIP
LIN
LIN Bus Master/Slave
SENT/SAE J2716
Tx/Rx Controller
Automotive Ethernet
TSN Ethernet Subsystem

Avionics/DO-254 Buses
MIL-STD 1553
ARINC 429
ARINC 825 CAN

SPI
Octal/Quad/Dual/Single SPI
XIP & DMA for AHB
XIP for AHB
Quad SPI
XIP & DMA for AHB
XIP for AHB
XIP for AXI
Master/Slave
Single SPI
Master/Slave
Bridges
SPI to AHB-Lite

I2C & SMBUS
Master/Slave Controller
I2C
Master  • Slave

These encryption cores make it easy to build security into a variety of systems.

GEON SoC Security
GEON Security
    Platform

Encryption Primitives
AES
AES, Programmable
  CCM, GCM, XTS
Key Expander
DES
Single, Triple

Hash Functions
SHA
SHA-3 (Keccak)
SHA-256
SHA-1
MD5
MD5

by CAST, Inc.

Related Links

Recent news summary page

Download this release (PDF).

News Tezzaron Chooses CAST IP Core for First Ever Stacked 3D IC Processor

Manufacturing fast, efficient 8051 core with patented vertical connection and wafer stacking technology produces processor with triple the typical speed

Shinagawa,Tokyo — IP Japan, May 19 2005

R80515 has been discontinued. Please contact Sales to learn more.

Customer Tezzaron® Semiconductor has implemented a core from intellectual property (IP) provider CAST, Inc., using patented wafer stacking technology to produce the first three-dimensional integrated circuit (3D IC) processor.

Tezzaron’s 3D IC processor uses the vertical connections and precise stacking of their FaStack® process to place 128 Kbytes of SRAM memory above the 8051-type processor and bind the two layers into a single device. Using a 160 nm technology, the resulting 3D IC runs up to ten times faster and requires only about 1/10th the power of a typical 8051. The core, CAST’s R80515, uses a reduced instruction set and other features that make it an effective and efficient embedded processor or controller.

“We wanted to demonstrate our technology with a workhorse processor that’s still used in thousands of products and devices around the world,” said Robert Patti, Tezzaron’s chief technology officer. “CAST proved to be a great partner—easy to work with and providing excellent support—and implementing their core was painless and straightforward.”

Tezzaron has delivered the 3D processor to several potential customers for evaluation. More information on both the processor and the FaStack® technology is available on the company’s web site at www.tezzaron.com. The 3D processor will also be running in a demonstration in CAST’s booth at the upcoming Design Automation Conference (www.dac.com).

About Tezzaron and the FaStack® Technology

The FaStack® process integrates multiple wafer layers and uses through-silicon vertical connections to produce remarkably dense and fast 3D chips. A special wafer thinning process solves the thermal build-up problem of previous stacking technologies, and the tight integration yields an IC that is significantly denser than similar-seeming System-in-Package (SiP) components. With their high speed, tiny size, superior memory access, and low power requirements, FaStack® ICs are suitable for a wide variety of applications, including embedded controllers, sensor arrays, and other high-end products and components.

Tezzaron is a privately held corporation, with offices in Illinois and Singapore. For sales information, call +1 (630) 505-0404 or email sales@tezzaron.com. For press information, contact Robert Patti by phone at +1 (630) 505-0404 x134 or by email at rpatti@tezzaron.com.

About CAST Incorporated

CAST provides about 100 popular and standards-based IP cores for ASICs and FPGAs. Privately owned and operating since 1993 with a focus on making IP practical and affordable, CAST has established a reputation for high-quality IP products, simple licensing, and responsive technical support. The company is headquartered near New York City, partners with IP developers around the world, and works with select sales consultants and distributors throughout Europe and Asia.

CAST is a trademark of CAST, Inc.
All other trademarks are the property of their respective owners.

 

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